Cloudion
Explore our CE-certified, high-density computing platforms configured with next-generation accelerators, flexible storage bays, and enterprise reliability.
Custom engineering capabilities meeting the demands of global AI research centers, high-density hosting providers, and modern neural network model training.
Deploying NVIDIA H100, H200, or Blackwell-based server infrastructures within European markets requires compliance with strict safety directives. Our hardware architectures are certified under CE standards, proving our electrical stability, low electromagnetic interference, and adherence to safe operational guidelines for modern data hubs.
Managing the thermal dissipation of high-wattage accelerators is our core competitive advantage. Our engineering division offers customized liquid loops (direct-to-chip or immersion), tailormade power distribution architectures, and optimized chassis design to control localized heat, maintaining computing efficiency under continuous load.
CloudionAI provides OEM/ODM manufacturing partnerships with cross-border shipping capabilities. Backed by 12+ years of industry knowledge and 7+ years of international shipping support, we optimize lead times, manage strict border compliance, and coordinate high-quality hardware integration.
The global demand for high-performance computing (HPC) has seen unprecedented expansion with the emergence of large-scale deep learning models, advanced machine translation, and complex molecular modeling. Modern enterprises are moving away from general-purpose CPUs toward specialized high-density accelerator topologies, specifically NVIDIA's compute platforms. Building, deploying, and maintaining these units requires an alignment of thermodynamic management, high-efficiency power design, and regulatory compliance.
As a leading high-performance AI GPU server manufacturer under the brand CloudionAI, Cloudion AI Systems Ltd is committed to designing, engineering, and manufacturing computing systems capable of supporting these modern tasks. Established in 2016, the company has combined 12 years of industry experience with 7 years of global shipment expertise to provide computing platforms that deliver stable processing power and strict system reliability.
The progression of NVIDIA server architectures has moved from standard PCIe form factors to high-density SXM multi-GPU systems linked by NVLink interconnects. While early systems focused on raw hardware counts, modern setups prioritize interconnect throughput. NVLink technology allows high-speed communication between accelerators, transforming the individual graphics cards into a single unified computing node. This architecture is vital for training modern LLMs, such as the DeepSeek series and LLaMA models, where latency between nodes directly impacts total compute efficiency.
To support this high-performance computing environment, server nodes must be designed with optimized motherboards, solid power management systems (often featuring redundant 900W, 1600W, or 2000W PSUs), and efficient thermal cooling. Our manufacturing facilities are equipped to assemble and configure these systems, integrating motherboards with Xeon or EPYC processors and high-capacity system memory (such as DDR4 RDIMM or DDR5 ECC modules) to guarantee consistent performance.
Procuring AI hardware for international markets is not just a hardware selection process; it requires navigating compliance systems. Among these, the CE Certification stands out as a critical requirement for European installations. It certifies that the server complies with standard directives including:
Failing to verify these compliance certifications can result in custom hold-ups, facility shutdowns, or potential hardware failure. CloudionAI addresses this concern by running all systems through multi-stage quality management checks, verifying compliance before shipping to North America, Europe, or Southeast Asia.
Our production hub spans approximately 18,600㎡, integrating assembly lines, testing chambers, and precision alignment machinery. Every GPU system undergoes structured quality checks to ensure long-term durability in active environments.






Our 48 professional inspectors execute the following testing routine:
Our supply chain is supported by more than 1,100 partners, ensuring access to quality components, including high-speed enterprise SSDs, SAS3808 M.2 RAID controller cards, memory modules, and specialized cooling solutions.
Hardware configurations must match the target workload. CloudionAI customizes GPU clusters to optimize computing outcomes across key environments:
1. Large Language Model Training and Fine-Tuning: Multi-socket rack servers equipped with dual Intel Xeon processors and multiple NVIDIA accelerators configured with NVLink bridges. These systems support training data pipelines, minimizing epoch latency.
2. Low-Latency Real-Time Inference: 1U or 2U compute nodes configured for high single-threaded CPU speed and fast GPU links to handle quick token generation for real-time applications.
3. Distributed Storage and High-Capacity NAS: Integration of hybrid SAS/SATA solid-state drives (such as the PM897 series) and bootcards (like the XP270 SAS3808) to provide stable data throughput and reliable system operation.
We work closely with clients to tailor systems to their specific design requirements, offering a range of customization options:
Our 320 R&D engineers work to turn technical concepts into functional hardware, helping us launch 86 new products last year to address shifting technological requirements.
Answers to common engineering, regulatory, and procurement questions regarding our high-density computing platforms.
CE certification proves that our hardware meets European safety, health, and environmental standards. It guarantees that our systems, operating under high currents, conform to EMC and Low Voltage directives, preventing electromagnetic interference and ensuring stable, safe electrical operation in enterprise environments.
We combine physical and fluid thermal design. Our chassis are engineered with independent cooling zones, high-pressure hot-swap fans, and optimized airflow routing. For high-density systems, we design and integrate liquid cooling solutions (closed-loop or direct-to-chip) to control temperatures and avoid thermal throttling.
Yes. We provide complete OEM/ODM options. Our 320 R&D engineers assist with structural design, custom PCB layout, cooling system configuration, firmware optimization, and regulatory certification to adapt hardware to your technical requirements.
By integrating high-end components with built-in power loss protection and hardware RAID, we isolate the host OS from primary data paths. This configuration reduces the risk of data corruption, ensures write performance, and protects critical system functions during unexpected power events.
Every computing node undergoes a thorough review process. Our quality team conducts Automated Optical Inspection (AOI), thermal stress testing, and hardware-in-the-loop diagnostic tests. Systems run under full load for at least 72 hours to verify memory, GPU pipelines, and power systems before packaging.
Access our selection of multi-socket rack servers, expansion modules, storage options, and system accelerators to scale your infrastructure.